Controlling Zinc Phosphate U.S. Patent 5456,810. Oct. 10, 1995 1. Kawasaki and T Sobafa, assignors to Nippon Paint Co. Ltd., Osaka, Japan

A method of measuring the activity of a zinc phosphate treatment solution, contain- ing complex hydrofluoric acid as an active material, for forming a zinc phosphate coating on a surface of an aluminum or aluminum alloy member, comprising add- ing a set amount of a simple fluoride to convert the aluminum salt to complex hy- drofluoric acid; evaluating the activity by measuring HF concentration consumed by the conversion; and adding the simple flu- oride to adjust its activity to within a con- trolled reference range.

Sputtering Target U.S. Patent .5,456,815. Oct. 10, 1995 H. Fukuyo et al., assignors fo Japan Energy Corp., Tokyo

A sputtering target of a high-purity alu- minum or an alloy thereof characterized in having been formed through recrystalliza- tion, and comprising grains where the av-

erage grain diameter in any portion of the target is 500 pm or less.

Nickel Alloy Electroplated Cold- Rolled Steel Sheet U.S. Patent 5,456,8X. Oct. 10, 1995 T: Watanabe et al., assignors to NKK Corp., Tokyo

A method for manufacturing a nickel alloy electroplated cold-rolled steel sheet excellent in press formability and phos- phating treatability, which comprises sub- jecting the continuously annealed cold- rolled steel sheet to a continuous nickel alloy electroplating treatment in an acidic electroplating bath to form a nickel alloy layer, said alloy consisting of particles of nickel alloy precipitated on at least one surface of the sheet, said nickel alloy par- ticles containing at least one of phospho- rus, boron, and sulfur in an amount within a range of l-15%, within a range of 5-60 mg/m” and then immersing into a neutral or alkaline bath to form a nickel alloy oxide film having an average thickness within a range of 0.0002-0.005 pm on the nickel alloy.

Surface Treatment For Copper Foil U.S. Patent 5,456,817. Ocf. 10, 1995 E. Hino et al, assignors fo Nikko Gould Foil Co. Ltd., Tokyo

A process for the surface treatment of a copper foil for printed circuits, said foil having a shiny side and a roughened side, comprising directly forming on the shiny side of the copper foil at a deposition quan- tity of 100 to 500 ,ug/dm’ either a Zn-Ni alloy layer consisting of 3 to 50% Ni or a Zn-Co alloy layer consisting of 3 to 50% Co; and then forming a Cr-base corrosion- preventive coating layer on the Zn alloy layer, whereby the shiny side acquires a thermal oxidation resistance of 240°C for 30 min or 270°C for IO min.

Process for Electrodeposition On Difficult-To-Plate Metals U.S. Patent .5,456,819. Ocf. 10, 1995 D.S. Lashmore and D. Kelley, assignors to The U.S.A. as represented by the Secretary of Commerce, Washington, DC.

A process for electroplating nickel or a

” to the Metal FIdsbimg Id

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