Huawei: Новые продукты Huawei Device на Российском рынке. Развитие рынка открытых платформ.

1. HUAWEI2012.10.05 2. 2 2011 . $32 140 000 , 44 % . 70 % . 31 . 3. . Huawei Device Huawei . 4. Huawei Cloud+ HUAWEI DEVICE Balong K3V2 Hi3630 HISILICON 5. Huawei - device-pipe-cloud - 6. Huawei , Huawei! , Huawei. Huawei , ? Huawei. 3- . 2012 2013 2014 2015 37% 52 % 75 % 85 % 95 % 7. Cloud Hisilicon K3V2; Emotion UI; Balong; 30 %, ; Microsoft 200 , ; ; Android; 8. - Ascend Youth Ascend Diamond Ascend Ascend Platinum GoldAscend D/P: -Ascend G/Y: : - 9. Ascend D P 1 2012 2 2012 3 2012 4 2012 1 2013 Ascend D1 i)Ascend D quad /D 4,5 HD TFT TI+IMC (2x1,5 ) ii)Ascend D quad XL 4,5 HD TFT i)K3V2+IMC(4x1,2 ), 1800 */ ii)K3V2+IMC(4x1,5 ), 2550 * i)Ascend P1/ Ascend P1 LTEP ii)Ascend P1 XL 4.3 QHD Super Amoled TI+IMC (2x1,5 ) i) 1800 * / 4.3 QHD Super Amoled MSM8960(2x1,5 ) ii)2550 * 10. Ascend G Y 1 2012 2 2012 3 2012 4 2012 1 2013 Ascend G 302 D Ascend G 330 Ascend G 600G 4.0 WVGA TFT 4.0 WVGA TFT MT 6575(1 ) ICS MSM8225(2x1) 4.5 FWVGA TFT MSM8225 (2x1 ) Ascend w1 WP8 Apollo Ascend Y 200 Ascend Y 202 3.5 HVGA TFT 3.5 HVGA TFTY MSM7225A (800 ) Ascend Y 100 2.8 QVGA TFT MSM7225A (800 ) MSM7225A (800 ) 11. Ascend G Y(II) 1 2012 2 2012 3 2012 4 2012 1 2013 Ascend G 301G 4.0 WVGA TFT MSM7227A (1 ) ICS Ascend Y 201 Ascend Y 201 Pro 3.5 HVGA TFT 3.5 HVGA TFTY MSM7225A (800 ) MSM7225A (800 ) RAM 256 +ROM 512 RAM 512 + ROM 4 Ascend Y 101 2.8 QVGA TFT MSM7225A (800 ) 12. MediaPad 10 FHD (LTE) MediaPad 10 FHD 10,1 1920x1200 10,1 1920x1200 CortexA9 Quad 1.2 CortexA9 Quad 1.2 LTE/HSPA+/WIFI HSPA+/WIFI Android ICS Android ICS MediaPad MediaPad 7 Lite MediaPad 10 Link MediaPad 2 10,1 1280x800 7 1280x800 IPS 7 1280x800 IPS 7 1024x600 CortexA9 Quad 1,2 CortexA9 Quad 1,2 HSPA+/WIFI HSDPA/WIFI HSPA+/WIFI LTE/HSPA+/WIFI MSM8260 2x1,2 Corte A8 1,2 Android ICS Android ICS 1 3 1 2013 2 13. HUAWEI TECHNOLOGIES CO., LTD. 14. HUAWEI TECHNOLOGIES CO., LTD. 15. HUAWEI TECHNOLOGIES CO., LTD.HISILICON SEMICONDUCTOR Page 15 16. 1 2 Huawei HUAWEI TECHNOLOGIES CO., LTD.HISILICON SEMICONDUCTOR Page 16 17. OTT 1 2 Google AD API Search API Facebook Chat, Graph, Ads Payments API AD API AD . , Map API , . . $ 3.154 B OPEN 2011. 3 4 Apple App store Q+ . . , 300 K 40K+ . . $ 120 M. HUAWEI TECHNOLOGIES CO., LTD. HISILICON SEMICONDUCTOR Page 17 18. OTT API . start-up Twilio . Apigee API Delivery Network API 2 . 500 . HUAWEI TECHNOLOGIES CO., LTD. HISILICON SEMICONDUCTOR Page 18 19. Twilio SMS 2008 2009 2010 2011 2012 VoIP Call Recording Text to Speech $ 0.7 M $ 3.7M 1 $ 12M 2 $ 17 M- 3 Voice to Text US, UK, CA, A, D, F, EI, Po API , 20K 14 2010 75K 2011 , . - : Twilios corporate info, Press releases, AIC analysis , API: 3rd Party : 3rd Party Single APIs & SDK for Capability worldwide development : Were looking for like-minded people to : 90% help us disrupt a $1.3 trillion industry Twilios career site HUAWEI TECHNOLOGIES CO., LTD. HISILICON SEMICONDUCTOR Page 19 20. Verizon Open Pipe 2011/07 2011/11 2012Q3 MBB : Verizon Pay-Per-Use Network Optimization API Turbo Boost QoS (jitter, delay, bandwidth, priority) . Verizon API 3G/LTE . Turbo Boost 2010 Verizon API , . Verizon Location, Messaging Network Optimization, Micropayments Microtransaction API . Turbo Boost , . . HUAWEI TECHNOLOGIES CO., LTD. HISILICON SEMICONDUCTOR Page 20 21. BlueVia Telefonica Digital Telefonica, Huawei Microsoft BlueVia 2011. one-stop PC, TV, , Xbox, 3rd Party Windows Application System Azure. Global 95 API HUB 70% , 70% , 50% , 20%SMSC MMSC WAP GW SRS SIA SMSC MMSC WAP GW SRS EAI SMSC MMSC WAP GW SRSEDW Customer SIM- Care Browsing O&M Colombia Peru EDW Customer SIM- EMS Care Browsing O&M EDW SIM- EMS Browsing O&M SIA Ecuador SMS/MMS. HUAWEI TECHNOLOGIES CO., LTD. HISILICON SEMICONDUCTOR Page 21 22. BlueViaHUAWEI TECHNOLOGIES CO., LTD.HISILICON SEMICONDUCTOR Page 22 23. HUAWEI TECHNOLOGIES CO., LTD.HISILICON SEMICONDUCTOR Page 23 24. IT , , , , , .. (, SMS, MMS, WAP, Push), IMS IT IT (RCSe) Cloud BSS, OSS, , CRM, BI, , , QoS/QoE, .., , , LBS .. HUAWEI TECHNOLOGIES CO., LTD. HISILICON SEMICONDUCTOR Page 24 25. 1 2 Huawei HUAWEI TECHNOLOGIES CO., LTD.HISILICON SEMICONDUCTOR Page 25 26. ! ... :)HUAWEI TECHNOLOGIES CO., LTD.HISILICON SEMICONDUCTOR Page 26 27. ? HUAWEI TECHNOLOGIES CO., LTD. HISILICON SEMICONDUCTOR Page 27 28. : , , Smart Private Public Pipe API Grid ITS Industry Industry , QoS, VPN, ... : , , Service API , SMS, IM, IVR, , , IMS ... Building Supporting : RCS, , ... Context API Enabling Enabling LBS, M2M, , ... , mash-up, Authentication API SSO, , Open ID, WiFi ... Device API , SMS, IM, , ... Mash-up : , , Cloud, , , IT Data & Info. API API API , SNS, Provisioning, , BI ... Billing & Charging API , , , ... HUAWEI TECHNOLOGIES CO., LTD. HISILICON SEMICONDUCTOR Page 28 29. 1 Networker Sever Provision(CRM) PCRF QoS HTTPS Open Pipe Cap. OCS/OFCS SOAP PCRF 2Mbps 4Mbps Network Download 100M video file: Push Server Rx/SOAP Before turbo: approx 25min After turbo: approx 5min Enabler QCI=6 Gy MBR=2Mbps QCI=9 iOS Android Gx MBR=4Mbps Networker Client SGSN/SGW/MME GGSN/PGW RAN/eNodeB , Networker Enabler : 1. Network Server, Network Server Provision. QoS 2. Provision OCS PCRF. , , 3. PCRF PCC ( QoS ) GGSN, GGSN .. QoS SGSN RAN. RAN Turbo Button . 4. . HUAWEI TECHNOLOGIES CO., LTD. HISILICON SEMICONDUCTOR Page 29 30. AD Platform AD API User Behavior Analysis : : 50 : : 1) 2) Turbo Button API 3) Video + Ads Open Platform : User context analysis, Mobile payments, ICT, M2M, NFC HUAWEI TECHNOLOGIES CO., LTD. HISILICON SEMICONDUCTOR Page 30 31. CP/SP/OTT , mobile payments OPEN SMS/WEB/APPs AD Click through rate > 5% AD Fee HUAWEI TECHNOLOGIES CO., LTD. HISILICON SEMICONDUCTOR Page 31 32. We can do more together than any one of us can do alone.HUAWEI TECHNOLOGIES CO., LTD.HISILICON SEMICONDUCTOR Page 32